JPS6262053B2 - - Google Patents

Info

Publication number
JPS6262053B2
JPS6262053B2 JP56195726A JP19572681A JPS6262053B2 JP S6262053 B2 JPS6262053 B2 JP S6262053B2 JP 56195726 A JP56195726 A JP 56195726A JP 19572681 A JP19572681 A JP 19572681A JP S6262053 B2 JPS6262053 B2 JP S6262053B2
Authority
JP
Japan
Prior art keywords
tray
die
holder
tray holder
wafer ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56195726A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5897844A (ja
Inventor
Noboru Fujino
Seiichi Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP19572681A priority Critical patent/JPS5897844A/ja
Publication of JPS5897844A publication Critical patent/JPS5897844A/ja
Publication of JPS6262053B2 publication Critical patent/JPS6262053B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Die Bonding (AREA)
JP19572681A 1981-12-07 1981-12-07 ダイ詰め換え装置 Granted JPS5897844A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19572681A JPS5897844A (ja) 1981-12-07 1981-12-07 ダイ詰め換え装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19572681A JPS5897844A (ja) 1981-12-07 1981-12-07 ダイ詰め換え装置

Publications (2)

Publication Number Publication Date
JPS5897844A JPS5897844A (ja) 1983-06-10
JPS6262053B2 true JPS6262053B2 (en]) 1987-12-24

Family

ID=16345935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19572681A Granted JPS5897844A (ja) 1981-12-07 1981-12-07 ダイ詰め換え装置

Country Status (1)

Country Link
JP (1) JPS5897844A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59211239A (ja) * 1983-05-17 1984-11-30 Nec Corp 半導体ペレツト配列機
KR0147403B1 (ko) * 1994-06-24 1998-11-02 문정환 칩자동 로딩장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036553A (en]) * 1973-08-03 1975-04-05
JPS55125641A (en) * 1979-03-22 1980-09-27 Nec Corp Automatic chip selection apparatus

Also Published As

Publication number Publication date
JPS5897844A (ja) 1983-06-10

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